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(Seoul=NSP NEWS AGENCY) = SK hynix will work closely with Taiwan’s TSMC to strengthen its capabilities in next-generation HBM production and advanced packaging technologies.

SK Hynix plans to collaborate with TSMC to develop HBM4(6th generation HBM), which is scheduled for mass production in 2026.

“By joining forces with TSMC, the world’s No.1 foundry, we will lead another breakthrough in HBM technology,” said SK hynix. “We will break through the limits of memory performance based on a three-way technology collaboration between customer, foundry and memory.”

First, both companies will begin to improve the performance of the base die, which is mounted at the bottom of the HBM package. HBM is made by stacking core dies, which are individual DRAM chips, on top of the base die and then connecting them vertically using TSV (Through Silicon Via) technology. The base die is connected to the GPU and plays the role of controlling HBM.

SK Hynix made the base die using its own process up to the 5th generation HBM3E, but plans to use the Logic front-end process starting from HBM4. This is because applying ultra-fine processes to produce this die can add various functions.

Through this, the company plans to produce customized HBM that meets a wide range of customer needs, including performance and power efficiency.

By Soon-ki Lee(s8789@nspna.com) and Bok-hyun Lee(bhlee2016@nspna.com)

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