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(Seoul=NSP NEWS AGENCY) = Samsung Electronics has started mass production of the industry’s thinnest 12nm-class LPDDR5X DRAM 12/16GB(gigabyte) package.

At 0.65 millimeters thick, it is the thinnest 12GB+ low-density(LPDDR) D-RAM available today. As it has become thinner, it is also expected to improve internal temperature control of mobile devices by securing additional space.

Samsung Electronics has stacked the industry’s smallest 12nm LPDDR DRAM in four layers and optimized the packaging technology, package circuit board, and EMC(epoxy molding composite) technology to reduce the thickness by approximately 9% compared to the previous generation products. Thermal resistance has also been improved by approximately 21.2%.

Samsung Electronics plans to continue to supply solutions optimized for the needs of customers in the on-device AI era by developing 24GB modules based on a 6-stage structure and 32GB modules based on an 8-stage structure in the thinnest LPDDR DRAM package in the future.

By Soon-ki Lee(s8789@nspna.com) and Jeonghwa Choi(choijh@nspna.com)

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